1. SiP packaging advantages

Compared to traditional wire packaging, SiP packaging has obvious advantages as a high-end packaging technology for various bare chip or module arrays and assemblies:

(1) High packaging efficiency: SiP packaging technology adds multiple chips within the same packaging body, greatly reducing packaging volume and improving packaging efficiency.

(2) Short product launch cycle: SiP packaging does not require layout and wiring at the layout level, thereby reducing the complexity of design, verification, and debugging and shortening the time of system implementation.

(3) Good compatibility: SiP can achieve a dream combination of embedded integrated passive components, and passive components in wireless and portable electronic devices can be embedded at least 30-50%. It can also integrate and package chip combinations of Si, GaAs, and InP.

(4) Reduce system costs: SiP can provide low-power and low-noise system level connections, and can achieve a wider bandwidth and almost equal bus bandwidth to SoC when operating at higher frequencies. A dedicated integrated circuit system can save more system design and production costs by using SiP packaging technology.

(5) Small physical size: The thickness of SiP packaging body is constantly decreasing, and the latest technology can achieve ultra-thin packaging with only 1.0mm thickness for five layer stacked chips, while the weight of three layer chip packaging is reduced by 35%.

(6) High electrical performance: SiP packaging technology can combine multiple packages into one, greatly reducing total solder joints, shortening the connection route of components, and thus improving electrical performance.

(7) Low power consumption: SiP packaging can provide low-power and low-noise system level connections, and can achieve almost the same bus width as SoC when operating at higher frequencies.

(8) Good stability: SiP packaging has good resistance to mechanical and chemical corrosion, as well as high reliability.

(9) Widely used: SiP packaging can not only handle digital systems, but also be applied in fields such as optical communication, sensors, and MEMS.

2. SiP Packaging Applications

SiP packaging technology is widely used in consumer electronics, communication, biomedical, and computer fields, and is also gaining increasingly widespread applications in industrial automation, aerospace, and automotive electronics. The devices, modules, and modules of SiP packaging technology include: processors, including: processors, controllers, sensors, etc. Moreover, with the continuous improvement of product performance requirements, SiP packaging technology has become the only solution for high-end chip packaging.http://www.ic-bom.com/